(2026)
Single-additive TSV filling achieved with a tris-ammonium-based suppressor.
MATERIALS & DESIGN.
263,
(2025)
Formation of twin structures via Cu electrodeposition with SPS and Cl-.
MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS.
322,
(2025)
Water-attracting adsorbates for enhancing the cyclability of Zn anodes in aqueous Zn-ion batteries.
JOURNAL OF MATERIALS CHEMISTRY A.
13,
37
(2025)
Extrapolability of machine learning for determining additive concentrations in copper electrolyte.
ELECTROCHIMICA ACTA.
533,
(2024)
Synergistic effect of CTA+ and Br- on defect-free TSV filling by Cu electrodeposition.
ELECTROCHIMICA ACTA.
503,
(2024)
Enhancing Proton Exchange Membrane Water Electrolysis with a Checkered Carbon Matrix Containing Ir-Ru Nanoparticles.
ADVANCED ENERGY MATERIALS.
14,
46
(2024)
Enhancement of heat dissipation in β-Ga<sub>2</sub>O<sub>3</sub> Schottky diodes through Cu-filled thermal vias: experimental and simulation investigations.
JOURNAL OF MATERIALS CHEMISTRY C.
12,
29
(2024)
Cu microvia filling by pulse-reverse electrodeposition with a single accelerator.
ELECTROCHIMICA ACTA.
490,
(2023)
Ir-Ru Electrocatalysts Embedded in N-Doped Carbon Matrix for Proton Exchange Membrane Water Electrolysis.
ADVANCED FUNCTIONAL MATERIALS.
33,
28
(2022)
Modulating the active sites of nickel phosphorous by pulse-reverse electrodeposition for improving electrochemical water splitting.
APPLIED CATALYSIS B-ENVIRONMENTAL.
308,
