For more details on the courses, please refer to the Course Catalog
| Code | Course Title | Credit | Learning Time | Division | Degree | Grade | Note | Language | Availability |
|---|---|---|---|---|---|---|---|---|---|
| EAM4017 | Metals | 3 | 6 | Major | Bachelor/Master | Korean | Yes | ||
| This field studies the properties of metals and alloys as affected by manufacturing, mechanical deformation and heat treatment which is concerned with the physical, mechanical and chemical characteristics of metals and alloys. This course includes phase transformation, welding metallurgy, fracture mechanics, and corrosion for alloy design. | |||||||||
| EAM4017 | Metals | 3 | 6 | Major | Bachelor/Master | Advanced Materials Science and Engineering | Korean | Yes | |
| This field studies the properties of metals and alloys as affected by manufacturing, mechanical deformation and heat treatment which is concerned with the physical, mechanical and chemical characteristics of metals and alloys. This course includes phase transformation, welding metallurgy, fracture mechanics, and corrosion for alloy design. | |||||||||
| EAM4018 | Electric and Electronic Materials | 3 | 6 | Major | Bachelor/Master | Japanese | Yes | ||
| ELECTRIC AND ELECTRONIC MATERIALS IS THE SUBJECT TO EXPLORE THE ELECTRONIC PROPERTIES OF SOLIDS AT THE UNDERGRADUATE LEVEL, WHILE PROVIDING AN INTEGRATED AND BALANCED STUDY OF SOLID-STATE PHYSICS, MATERIALS, AND DEVICE APPLICATIONS. THIS CLASS ALSO FEATURES A DESIGN EXERCISES THAT EXTEND AND MOTIVATE THE PRESENTATION OF SOLID-STATE THEORIES, MATERIALS' STRUCTURES AND PHYSICAL PROPERTIES, AND THEN EXPLORES THE PROPERTIES AND APPLICATIONS OF SPECIFIC SOLIDS, INCLUDING METALS, SEMICONDUCTORS, INSULATORS, MAGNETIC SOLIDS, SUPERCONDUCTORS, AND LIGHT-SENSITIVE SOLIDS. | |||||||||
| EAM4018 | Electric and Electronic Materials | 3 | 6 | Major | Bachelor/Master | Advanced Materials Science and Engineering | Japanese | Yes | |
| ELECTRIC AND ELECTRONIC MATERIALS IS THE SUBJECT TO EXPLORE THE ELECTRONIC PROPERTIES OF SOLIDS AT THE UNDERGRADUATE LEVEL, WHILE PROVIDING AN INTEGRATED AND BALANCED STUDY OF SOLID-STATE PHYSICS, MATERIALS, AND DEVICE APPLICATIONS. THIS CLASS ALSO FEATURES A DESIGN EXERCISES THAT EXTEND AND MOTIVATE THE PRESENTATION OF SOLID-STATE THEORIES, MATERIALS' STRUCTURES AND PHYSICAL PROPERTIES, AND THEN EXPLORES THE PROPERTIES AND APPLICATIONS OF SPECIFIC SOLIDS, INCLUDING METALS, SEMICONDUCTORS, INSULATORS, MAGNETIC SOLIDS, SUPERCONDUCTORS, AND LIGHT-SENSITIVE SOLIDS. | |||||||||
| EAM4019 | Electronic Package Engineering | 3 | 6 | Major | Bachelor/Master | Korean | Yes | ||
| The electronic package engineering is a fusion technology closely related to mechanical engineering, electron engineering, materials engineering, and chemical engineering etc. Component or electronics are assembled with different functional devices, and the length of circuit is approaches to a few m. The troubles (Ohm match, corrosion, mechanical problems etc.) caused at the interface between different devices or materials can be solved by various surface finishes such as ENIG, ENEPIG, OSP, HASL, electro plating, and electroless plating etc. Electronic package technology requires many functions such as thermal management, power redistribution, signal distribution and mechanical support. The electronic package components must meet their characteristics after reliability test such as IPC, JEDEC etc. This lecture introduces the manufacture process of electronic package components and the core technologies including materials for electronic packaging, system in packaging, system on chip, printed circuit board, surface finishes, flip chip, through silicon via, the materials and process for interconnection technology, printed electronics, the reliability regulation for electronic components, and test kits etc. | |||||||||
| EAM4019 | Electronic Package Engineering | 3 | 6 | Major | Bachelor/Master | Advanced Materials Science and Engineering | Korean | Yes | |
| The electronic package engineering is a fusion technology closely related to mechanical engineering, electron engineering, materials engineering, and chemical engineering etc. Component or electronics are assembled with different functional devices, and the length of circuit is approaches to a few m. The troubles (Ohm match, corrosion, mechanical problems etc.) caused at the interface between different devices or materials can be solved by various surface finishes such as ENIG, ENEPIG, OSP, HASL, electro plating, and electroless plating etc. Electronic package technology requires many functions such as thermal management, power redistribution, signal distribution and mechanical support. The electronic package components must meet their characteristics after reliability test such as IPC, JEDEC etc. This lecture introduces the manufacture process of electronic package components and the core technologies including materials for electronic packaging, system in packaging, system on chip, printed circuit board, surface finishes, flip chip, through silicon via, the materials and process for interconnection technology, printed electronics, the reliability regulation for electronic components, and test kits etc. | |||||||||
| EAM4020 | Introduction to organic and polymeric materials | 3 | 6 | Major | Bachelor/Master | English | Yes | ||
| This course introduces structures, properties, synthesis, and applications of various organic and polymeric materials. | |||||||||
| EAM4020 | Introduction to organic and polymeric materials | 3 | 6 | Major | Bachelor/Master | Advanced Materials Science and Engineering | English | Yes | |
| This course introduces structures, properties, synthesis, and applications of various organic and polymeric materials. | |||||||||
| EAM5201 | Crystal Chemistry | 3 | 6 | Major | Master/Doctor |
1-4
1-4 |
Korean | Yes | |
| Crystals are classified into ionic, covalent and metallic crystals in terms of the nature of bond. Corresponding physical properties of the crystals are introduced. The nature of the bond in crystals is explained by lattice energy theory, molecular orbital theory or band theory. | |||||||||
| EAM5202 | Semiconductor Analysis | 3 | 6 | Major | Master/Doctor | 1-4 | English | Yes | |
| Basic physics related to electrical and optical properties of semiconductor. Principle and characteristics of various analytical techniques including DLTS, Hall, Electrochemical C-V, PITCS, PL, AES, and EPMA | |||||||||
| EAM5203 | Thermodynamics of Solid | 3 | 6 | Major | Master/Doctor | 1-4 | English | Yes | |
| The more detailed thermodynamic relations in solid solution and reaction will be discussed, which are based on the basic thermodynamic concepts. | |||||||||
| EAM5204 | Phase Transformations | 3 | 6 | Major | Master/Doctor | 1-4 | Korean | Yes | |
| Various phase transformations of materials such as homogeneous, heterogeneous, diffusional, and nondiffusional transformations during processes are introduced. In addition, phase transformation phenomena will be correlated to characteristics of crystal, thermodynamics and resultant mechanical properties of materials | |||||||||
| EAM5205 | Advanced Structure Control Engineering | 3 | 6 | Major | Master/Doctor | 1-4 | - | No | |
| Structure control engineering is one of the key technologies for R&D as well as manufacturing. This lecture reviews fundamental structure control devices of mechanical, electrical, electrical operation, Using diverse approaches, the application of this control devices is also covered. | |||||||||
| EAM5206 | Advanced Mechanical Metallurgy | 3 | 6 | Major | Master/Doctor | 1-4 | English | Yes | |
| Mechanical properties of materials and their relating variables will be studied. First, relationship between stress and strain, fundamental theory of elastic and plastic behavior, and plastic deformation of single and polychromate will be understood. Second, relationship between mechanical properties of materials and their microstructure and defects such as dislocation, vacancy, and grain boundary will be characterized. Finally, measurements of mechanical properties such as hardness, strength, elastic modules, and fracture toughness, fatigue and creep phenomena, and creep resistant materials will be studied. | |||||||||
| EAM5207 | Electronic Properties of Advanced Material | 3 | 6 | Major | Master/Doctor | 1-4 | - | No | |
| Structure and behavior of atoms and electrons in solids ; bonding, energy band, Brillouin zone construction, free electron theory, etc.. Theory and properties of electrical, thermal, magnetic, and optical materials. | |||||||||