For more details on the courses, please refer to the Course Catalog
| Code | Course Title | Credit | Learning Time | Division | Degree | Grade | Note | Language | Availability |
|---|---|---|---|---|---|---|---|---|---|
| EME7002 | Introduction to plasmas and gas discharges | 3 | 6 | Major | Bachelor/Master/Doctor | 1-8 | Mechanical Engineering | Korean | Yes |
| This course aims to provide a deeper understanding of partially ionized gases, namely plasma, by learning plasma fluidic equations and applying these equations to analyze the characteristics of various plasma sources. In detail, this course will cover the following four main topics: 1) Students will first learn statistical thermodynamics and kinetic theory as prior knowledge necessary for understanding plasma fluidic equations. 2) The derivation of plasma thermofluidic governing equations will be taught. 3) Energy and momentum transfer processes through elastic collisions under a variety of intermolecular potentials, and particularly electron-impact ionization processes, will be discussed. 4) Finally, students will apply plasma fluidic equations to analyze plasma behaviors in dc glow gas discharges, RF CCP, RF ICP, and magnetron plasmas, gaining insights into plasma and their analysis. | |||||||||
| EME7003 | CMP Process and Equipment Technology | 3 | 6 | Major | Bachelor/Master/Doctor | Korean | Yes | ||
| Chemical Mechanical Planarization (or Polishing) (CMP) process was adopted into mass production of semiconductor device by IBM in 1983. With the smaller design rule and complex structures of the state-of-the-art device, CMP becomes more important and more number of CMP steps are employed. In this course, basic theory of CMP, consumables (slurry, pad, conditioner, and filter), post-CMP cleaning, and equipment technology are covered to provide theoretical understanding of CMP process. | |||||||||
| EME7003 | CMP Process and Equipment Technology | 3 | 6 | Major | Bachelor/Master/Doctor | Mechanical Engineering | Korean | Yes | |
| Chemical Mechanical Planarization (or Polishing) (CMP) process was adopted into mass production of semiconductor device by IBM in 1983. With the smaller design rule and complex structures of the state-of-the-art device, CMP becomes more important and more number of CMP steps are employed. In this course, basic theory of CMP, consumables (slurry, pad, conditioner, and filter), post-CMP cleaning, and equipment technology are covered to provide theoretical understanding of CMP process. | |||||||||
| EME7004 | Micro/Nanoscale Heat Transfer and Semiconductor Thermal Properties | 3 | 6 | Major | Bachelor/Master/Doctor | Korean | Yes | ||
| This course consists of three parts. The first part provides an overview of microscopic thermal transport theory and draws heavily from literature on solid-state physics and physical gas dynamics. The microscopic treatment culminates with a derivation of the Onsager relations for thermoelectric phenomena and Fourier’s law. The second part of the class describes data and models for the thermal conductivities of solids, liquids, and gases, and for the thermal resistances at solid-solid and solid-fluid interfaces. The goal is to show how thermal transport properties vary with temperature, pressure, and stoichiometric and phase purity. The third and final part of the class summarizes techniques for integrating the heat-diffusion equation. This final part of the course is rich in mathematics and is comparable to material covered in more traditional courses on heat conduction. | |||||||||
| EME7004 | Micro/Nanoscale Heat Transfer and Semiconductor Thermal Properties | 3 | 6 | Major | Bachelor/Master/Doctor | Mechanical Engineering | Korean | Yes | |
| This course consists of three parts. The first part provides an overview of microscopic thermal transport theory and draws heavily from literature on solid-state physics and physical gas dynamics. The microscopic treatment culminates with a derivation of the Onsager relations for thermoelectric phenomena and Fourier’s law. The second part of the class describes data and models for the thermal conductivities of solids, liquids, and gases, and for the thermal resistances at solid-solid and solid-fluid interfaces. The goal is to show how thermal transport properties vary with temperature, pressure, and stoichiometric and phase purity. The third and final part of the class summarizes techniques for integrating the heat-diffusion equation. This final part of the course is rich in mathematics and is comparable to material covered in more traditional courses on heat conduction. | |||||||||
| EPO5009 | Rubber Engineering | 3 | 6 | Major | Master/Doctor | 1-4 | Polymer Science and Engineering | - | No |
| Regarded as the most fundamental theory in the polymer materials, the rubber elasticity, synthesis, compounding and the effects of the fillers and plasticizers are covered during the course. The most advanced rubber formulation, additives, reaction kinetics, processing will be discussed. Particularly, 3D pringing materials for elastomers will be also covered. In addition to "Elastomer Engineering" and "Seminar on Elastomers" courses, it is recommended for the students who would like to take Vehicle Track under Interdisciplinary Materials Science & Engineering. | |||||||||
| EPO5015 | Polymeric CompositesⅡ | 3 | 6 | Major | Master/Doctor | 1-4 | Polymer Science and Engineering | - | No |
| Most polymer composite processing techniques will be chosen and discussed in terms of theoretical aspects and mathematical modeling approaches. The unique characteristics and functional specialties of polymer composites will be addressed in comparison with metals, and the experimental techniques will be measurement in this class. | |||||||||
| EPO5028 | Polymeric CompositesⅠ | 3 | 6 | Major | Master/Doctor | 1-4 | Polymer Science and Engineering | - | No |
| The manufacturing processes and property characteristics of fiber reinforced polymer composite materials will be covered in this class. As matrices, several commodity and advanced thermoset and thermoplastic polymers will be addressed and the characteristic properties of higi performance fibers will be discussed; carbon, glass, aramid, boron fibers, etc. | |||||||||
| ERC2006 | Creative Engineering Design | 3 | 6 | Major | Bachelor | 2-3 | Engineering | - | No |
| This course will introduce basic qualities for design engineers that will form the foundation for life-long learning for all engineers through team-based project-based learning. The qualities for designers covered include: creative problem solving ability, visual reasoning and sketching ability, teamwork ability, ability to understand consumer trends and consider user perspectives, ability to represent functions reflecting user requirements and generating concepts to realize such functions, ability to discuss about design contents as well as reporting and presenting. | |||||||||
| ERC2007 | Engineering Numerical Analysis | 3 | 6 | Major | Bachelor | 2-3 | Engineering | Korean,English,Korean | Yes |
| We deal with the major sources of errors in numerical methods, the approximated solution of non-linear equations, the solution of simultaneous linear equations, polynomial interpolation, numerical differentiation, numerical integration, and curve fitting to measured data as a technique to solve the mathematical problems in scientific and engineering area. | |||||||||
| ERC2008 | Introduction to Management of Technology | 3 | 6 | Major | Bachelor | 2-3 | Engineering | Korean,Korean | Yes |
| This subject handles various theory and practical application about MOT. Main contents are Test of technical innovation process, R&D strategy, patent administration, R&D project plan establishment, Market analysis, Technology Assessment, Technology Contract, Technology Management. | |||||||||
| ERC2009 | Interdisciplinary Capstone Design | 3 | 6 | Major | Bachelor | 2-4 | Engineering | - | No |
| This course is a senior level capstone design course in College of Engineering and School of Information & Communication Engineering, emphasizes a real world level of interdisciplinary efforts associated with the industries. The students of this course will explore traditional and new issues, and study on interdisciplinary knowledge and theory. Also, they will try to apply the diverse engineering sciences to the problem, explore and analysis feasible solutions, develop a best solution, and communicate their results each other. Each team will consist of students from several different departments, and be supported by professors from College of | |||||||||
| ERC2010 | Fundamental Mathematics in Engineering1 | 3 | 6 | Major | Bachelor | Engineering | Korean,English,Korean | Yes | |
| This course focuses on ordinary differential equations (ODEs) and complex analysis with engineering applications in mind. Topics include: first-order ODEs, second-order ODEs, Laplace transform, systems of ODEs, Cauchy-Riemann equation, and conformal mapping. | |||||||||
| ERC2011 | Fundamental Mathematics in Engineering2 | 3 | 6 | Major | Bachelor | Engineering | Korean,English,Korean | Yes | |
| This course starts with core concepts in linear algebra, especially those useful in various engineering disciplines. Next, several applications of partial differential equations (PDEs) will be introduced with their solution techniques. While doing so, we will investigate the theoretical and practical importance of Fourier series. | |||||||||
| ERC3001 | Global Capstone Design | 3 | 6 | Major | Bachelor | 3-4 | Engineering | Korean | Yes |
| This course covers the innovative design process based on international and interdisciplinary design teams by exploring users' various needs, defining design problems, reflecting practical constraints, generating diverse concepts, evaluating and refining final solutions and prototyping. The multidisciplinary design theories and methodologies will be addressed to guide the design process. Therefore, in this course, core capabilities for next generation engineers such as global competitiveness, innovation ability and interdisciplinary capstone design ability can be significantly fostered. | |||||||||